GB4N0016TPI-1

Panduit GB4N0016TPI-1 Telecom Grounding Busbar

Panduit GB4N0016TPI-1 Panduit GB4N0016TPI-1 Telecom Grounding Busbar

GB4N0016TPI-1

Product Lifecycle: Active

Panduit GB4N0016TPI-1 Telecom Grounding Busbar

Panduit
  • Total Stock Found

    0

  • Total Suppliers

    17
  • Suppliers with Stock

    0

Product Suppliers

SUPPLIER

QTY

QUOTE

Heitek Automation

Phoenix, AZ

Steven Engineering

South San Francisco, CA

Request

Buckles-Smith Electric

Santa Clara, CA

Request

Crum Electric Supply

Casper, WY

Request

Product Details

Additional Documents

Part Features
Available with different hole pattern spacing including NEMA, BICSI and 1 inch, Made of high conductivity copper and tin-plated to inhibit corrosion, Pre-assembled with brackets and insulators attached for quick installation
Standards Met
BICSI/TIA-607-C, NEMA Hole Pattern, cULus
Product Type
Grounding Busbars
Application
Telecom/Data Center
Overall Thickness (mm)
6.4
Finish/Coating
Tin-Plated
Overall Thickness (In.)
0.25
Overall Width (mm)
101.6

Relevant Products

    Product Manufacturer

    Panduit

    Product Category

    Electrical